Qualcomm Snapdragon XR2+ Gen 2 chip to power Samsung’s XR headset

Snapdragon

Qualcomm introduces the robust Snapdragon XR2+ Gen 2 chipset, slated for Samsung’s forthcoming extended reality XR headset.
  • “Snapdragon XR2+ Gen 2 unlocks 4.3K resolution which will take XR productivity and entertainment to the next level by bringing spectacularly clear visuals to use cases such as room-scale screens, life-size overlays and virtual desktops,” said Hugo Swart, VP and GM of XR at Qualcomm.
  • “We are advancing our commitment to power the best XR devices and experiences that will supercharge our immersive future.”
  • The chipset features a 15 percent increase in GPU and a 20 percent boost in CPU frequency over the regular XR2 Gen 2 Notably, it supports 12+ concurrent cameras for advanced hand and body tracking.
  • The Snapdragon XR2+ Gen 2 also introduces a rapid 12ms full-color video see-through and supports Wi-Fi 7.
  • Anticipation is growing around Samsung’s upcoming XR headset, positioned as a competitor to Apple’s Vision Pro.
  • The headset is expected to be unveiled alongside the Galaxy Z Flip 6 in the year’s second half.
  • Samsung is thrilled to collaborate with Qualcomm Technologies and Google in revolutionizing the mobile industry once more,” commented Inkang Song, VP and head of the technology strategy team at Samsung.

 

Snapdragon

 

  • “With Samsung’s mobile expertise and our joint commitment, we aim to create the best-in-class XR experience for Galaxy users.”
  • Like the Vision Pro, Samsung’s XR headset is expected to initially be geared towards enthusiasts due to its much higher cost than lower-powered consumer headsets. Initial production is set to be limited to 30,000 units.
  • “We look forward to continuing our collaboration with Qualcomm Technologies and Samsung on the future of immersive and spatial XR,” said Shahram Izadi, VP of AR at Google.
  • “We’re excited for the Android ecosystem to take advantage of Snapdragon XR2+ Gen 2’s capabilities and enable new experiences,” added Shahram.

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